B Set – Rack-Level Power Interconnect System (C14–C15, W80P1)
MS Input – One Page Summary
(For Microsoft Review / Please Forward to Microsoft)
Rack-Level Power Interconnect System (C14–C15, W80P1)
Purpose
This note is intended to allow MS to assess whether the power interconnect architecture and delivery model described below are appropriate for data center rack deployments, and not to validate supplier or product certifications.
System Overview
We propose a rack-level power interconnect system designed for internal power connections within data center racks.
The objective is to establish a standardized, repeatable, and compliant power cord configuration that can be consistently reused across rack builds once validated.
This is not a one-time accessory selection.
What This Is
- Rack-level IEC power interconnect system
- C14 to C15 configuration
- Designed for in-rack equipment power connections
- Delivered as a standardized rack BOM item, not ad-hoc sourcing
Key characteristics
- Rated 250V / 15A
- Fixed-length configuration (baseline: 1830 mm)
- High-temperature–rated C15 connector
- UL-listed power cord construction
- Consistent marking and batch identification
Why This Matters
In large-scale rack deployments, power cords introduce real operational risk when not standardized:
- Inconsistent specifications complicate rack assembly
- Incorrect temperature ratings affect long-term reliability
- Mixed sourcing increases maintenance and replacement complexity
This system aims to reduce variability at the rack level, ensuring predictable installation and stable long-term operation.
Key Technical Constraints
- IEC C14 → C15 configuration
- True high-temperature C15 connector
- Rated 250V / 15A
- Fixed length for rack consistency
- UL-listed construction
- Stable marking and batch-level traceability
Reference Alignment
This power interconnect approach aligns with hyperscale data center rack practices commonly used in NVIDIA-based and IB-enabled environments.
Power cords are treated as rack infrastructure components, evaluated based on compliance, consistency, and deployment reliability, rather than platform-specific certification.
Question for MS
Based on your rack deployment experience:
- Is this standardized C14–C15 rack-level power interconnect approach consistent with current MS rack practices?
- Are there any concerns regarding connector type, electrical rating, or delivery model?
End of Summary
B 套|机柜级电源互连系统(C14–C15,W80P1)
MS 输入版 · 一页说明
(供 Microsoft 审阅|请转发至 Microsoft)
机柜级电源互连系统(C14–C15,W80P1)
目的
本说明用于协助 MS 判断下述 电源互连架构与交付模型 是否适用于 数据中心机柜部署,
并非用于验证供应商或具体产品的认证情况。
系统概述
我们提出的是一套用于 数据中心机柜内部电源连接 的
机柜级电源互连系统。
该系统的目标是形成一套 标准化、可重复、合规的电源线配置方案,
在完成验证后可在多柜部署中持续复用。
这并不是一次性的辅料选型。
系统定义
- 机柜级 IEC 电源互连系统
- C14 → C15 接口形式
- 用于 机柜内部设备电源连接
- 作为 标准化机柜 BOM 项 交付,而非临时采购
关键特性
- 额定 250V / 15A
- 固定长度配置(基线:1830 mm)
- 高温等级 C15 连接器
- UL Listed 电源线结构
- 统一的 Marking 与批次标识
为什么重要
在大规模机柜部署中,电源线若缺乏统一标准,会带来实际运行风险:
- 规格不一致增加装柜复杂度
- 连接器耐温等级错误影响可靠性
- 多来源供货增加维护与更换成本
该系统的目标,是在机柜层面降低差异性,
确保安装可预测、运行稳定。
关键技术约束
- IEC C14 → C15
- 真实高温等级 C15
- 额定 250V / 15A
- 固定长度,保证机柜一致性
- UL Listed
- 稳定的 Marking 与批次可追溯
参考实践对齐说明
该电源互连方式对齐 Hyperscaler 数据中心机柜的通用实践,
并广泛应用于 NVIDIA-based / IB 机柜环境。
电源线在此被视为 机柜基础设施组件,
评估重点在于 合规性、一致性与部署可靠性,而非平台级认证。
给 MS 的问题
基于 MS 的机柜部署经验:
- 这种 C14–C15(高温)机柜级电源互连方式 是否为 MS 当前常用或可接受的实践?
- 在接口类型、电气规格或交付模型上,是否存在明显风险或需要调整的地方?
—— 完 ——
B Set – Rack-Level Power Interconnect System (C14–C15, W80P1)
Clarification on Certification and Evaluation Scope
Power cords, like passive optical cabling, are not certified by NVIDIA at the individual product level.
In data center deployments, NVIDIA Reference Design provides system-level rack infrastructure practices, rather than certifications for specific passive components.
What is being proposed here is a rack-level C14–C15 power interconnect system, evaluated based on:
- Connector type and temperature rating
- Electrical compliance (UL Listed)
- Consistency and suitability for large-scale, repeatable rack deployment
The intent is to confirm whether this power interconnect architecture and delivery model align with MS IB rack practices, rather than whether a power cord itself is “NVIDIA certified.”
Candidate Supplier Paths – MS-Friendly Reference
The following are commonly understood and widely used supply paths in hyperscale and NVIDIA-based data center projects.
They do not represent claims of NVIDIA-certified products.
Path 1 – Preferred
Tier-1 Power and Connector Vendors (Common in NVIDIA / Hyperscale Environments)
Characteristics
- Long-term participation in data center and AI / IB rack deployments
- Products are UL Listed and used in NVIDIA-based rack environments
Representative vendors
- Volex
- Interpower
- Tripp Lite (Eaton)
- Schurter
Reference statement
These vendors are commonly used for power interconnects in hyperscale and NVIDIA-based data center racks.
Path 2 – Most Common in Practice
Tier-2 Power Cord Suppliers to Tier-1 ODMs / Integrators
Characteristics
- Not marketed as NVIDIA suppliers
- Long-term suppliers to Quanta / Foxconn / Wistron / Inventec
- Support C14–C15 configurations, UL compliance, and volume delivery
Reference statement
These suppliers typically deliver power cords into NVIDIA-based racks through Tier-1 ODMs rather than as branded products.
Path 3 – Supplemental
Mature Data Center Infrastructure Brands
Characteristics
- Well recognized within Microsoft and hyperscaler ecosystems
- Strong compliance, specification control, and delivery stability
Representative vendors
- Eaton
- Legrand
- Panduit
Unified Mandatory Requirements (Vendor-Independent)
All candidate suppliers must meet all of the following:
- C14–C15 configuration with high-temperature C15 connector
- Rated 250V / 15A
- UL Listed (UL File Number required)
- Consistent length, tolerance, and marking
- Stable batch-level delivery capability
Question for MS
Based on MS IB rack experience, is C14–C15 (high-temperature) power interconnect the preferred or commonly accepted approach?
End of Document
B 套|机柜级电源互连系统(C14–C15,W80P1)
关于认证与评估范围的说明
与被动光纤产品类似,电源线并不存在 NVIDIA 单独出具的产品级认证。
在数据中心项目中,参考的是 NVIDIA Reference Design 对机柜基础设施的系统级实践,而不是某一根被动器件是否被认证。
当前讨论的是一套 机柜级 C14–C15 电源互连系统,评估重点包括:
- 接口类型与耐温等级
- 电气合规性(UL Listed)
- 是否适合规模化、重复的机柜部署
核心目的是确认:
这种电源互连架构与交付模型是否符合 MS 的 IB 机柜实践,而非讨论“是否 NVIDIA 认证”。
候选供应商路径清单(MS 友好版)
以下为 在 Hyperscaler / NVIDIA-based 数据中心中常见、可被理解的供货路径,
并非宣称 NVIDIA 认证产品。
路径一(优先)
Tier-1 电源与连接器厂商(NVIDIA / Hyperscaler 常见)
特点
- 长期服务数据中心与 AI / IB 机柜
- 产品通过 UL,实际应用于 NVIDIA-based 机柜环境
代表性厂商
- Volex
- Interpower
- Tripp Lite(Eaton)
- Schurter
路径二(最现实、最常用)
Tier-1 ODM / 集成商的二级电源线供应商
特点
- 不直接强调 NVIDIA 背景
- 长期给 Quanta / Foxconn / Wistron / Inventec 等供货
- 覆盖 C14–C15、UL 合规与批量交付
路径三(补充)
成熟数据中心基础设施品牌
特点
- Microsoft / Hyperscaler 更为熟悉
- 认证、规格与交付稳定性高
代表性厂商
- Eaton
- Legrand
- Panduit
B 套供应商的统一硬性要求
- C14–C15,高温等级 C15
- 250V / 15A
- UL Listed(需提供 UL File Number)
- 长度、公差与 Marking 一致
- 批量交付稳定可靠
建议向 MS 提出的问题
基于 MS 的 IB 机柜部署经验,
—— 完 ——